ic
TPA2013D1RGPR
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VDD | power | SMD | roundrect | 0.28×0.8 | |
| VCCFB | output | SMD | roundrect | 0.28×0.8 | |
| GAIN | io | SMD | roundrect | 0.28×0.8 | |
| AGND | ground | SMD | roundrect | 0.28×0.8 | |
| SDD# | passive | SMD | roundrect | 0.28×0.8 | |
| SDB# | passive | SMD | roundrect | 0.8×0.28 | |
| IN- | passive | SMD | roundrect | 0.8×0.28 | |
| IN+ | passive | SMD | roundrect | 0.8×0.28 | |
| PGND | ground | SMD | roundrect | 0.8×0.28 | |
| PGND | ground | SMD | roundrect | 0.8×0.28 | |
| VOUT- | passive | SMD | roundrect | 0.28×0.8 | |
| VOUT- | passive | SMD | roundrect | 0.28×0.8 | |
| VOUT+ | passive | SMD | roundrect | 0.28×0.8 | |
| VOUT+ | passive | SMD | roundrect | 0.28×0.8 | |
| VOUT+ | passive | SMD | roundrect | 0.28×0.8 | |
| VCCIN | passive | SMD | roundrect | 0.8×0.28 | |
| VCCOUT | passive | SMD | roundrect | 0.8×0.28 | |
| SW | output | SMD | roundrect | 0.8×0.28 | |
| SW | output | SMD | roundrect | 0.8×0.28 | |
| PGND | ground | SMD | roundrect | 0.8×0.28 | |
| PAD | passive | SMD | roundrect | 2.7×2.7 |
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Details
- Category
- ic
- MPN
- TPA2013D1RGPR
- Manufacturer
- Texas Instruments
- Package
- QFN-20-EP(4x4)
- Footprint
- QFN-20_L4.0-W4.0-P0.50-BL-EP2.7
- JLCPCB
- C129808
- LCSC
- C129808
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(2,274 pcs)
1-9 pcs$1.3944
10-29 pcs$1.1535
30-99 pcs$1.0217
100-499 pcs$0.8723
500-999 pcs$0.8065
1000+ pcs$0.7759