ic
TPA311DGN
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SHUTDOWN | input | SMD | roundrect | 0.364×1.43 | |
| BYPASS | output | SMD | roundrect | 0.364×1.43 | |
| SE/BTL# | io | SMD | roundrect | 0.364×1.43 | |
| IN | passive | SMD | roundrect | 0.364×1.43 | |
| VO+ | passive | SMD | roundrect | 0.364×1.43 | |
| VDD | power | SMD | roundrect | 0.364×1.43 | |
| GND | ground | SMD | roundrect | 0.364×1.43 | |
| VO– | passive | SMD | roundrect | 0.364×1.43 | |
| EP | passive | SMD | roundrect | 1.8×1.5 |
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Details
- Category
- ic
- MPN
- TPA311DGN
- Manufacturer
- Texas Instruments
- Package
- HVSSOP-8-EP
- Footprint
- HVSSOP-8_L3.0-W3.0-P0.65-LS4.9-BL-EP
- JLCPCB
- C2879170
- LCSC
- C2879170
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.0025
10-29 pcs$1.0025
30-199 pcs$1.0025
200-499 pcs$0.3888
500-999 pcs$0.3743
1000+ pcs$0.3679