ic
TPA6013A4PWP
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| PGND | ground | SMD | oval | 0.343×1.747 | |
| ROUT− | output | SMD | oval | 0.343×1.747 | |
| PVDD | power | SMD | oval | 0.343×1.747 | |
| RHPIN | passive | SMD | oval | 0.343×1.747 | |
| RLINEIN | passive | SMD | oval | 0.343×1.747 | |
| RIN | passive | SMD | oval | 0.343×1.747 | |
| VDD | power | SMD | oval | 0.343×1.747 | |
| LIN | passive | SMD | oval | 0.343×1.747 | |
| LLINEIN | passive | SMD | oval | 0.343×1.747 | |
| LHPIN | passive | SMD | oval | 0.343×1.747 | |
| PVDD | power | SMD | oval | 0.343×1.747 | |
| LOUT− | passive | SMD | oval | 0.343×1.747 | |
| PGND | ground | SMD | oval | 0.343×1.747 | |
| LOUT+ | passive | SMD | oval | 0.343×1.747 | |
| SHUTDOWN# | passive | SMD | oval | 0.343×1.747 | |
| FADE# | passive | SMD | oval | 0.343×1.747 | |
| BYPASS | passive | SMD | oval | 0.343×1.747 | |
| AGND | ground | SMD | oval | 0.343×1.747 | |
| SEMAX | passive | SMD | oval | 0.343×1.747 | |
| SEDIFF | passive | SMD | oval | 0.343×1.747 | |
| VOLUME | passive | SMD | oval | 0.343×1.747 | |
| HP/LINE# | passive | SMD | oval | 0.343×1.747 | |
| SE/BTL# | passive | SMD | oval | 0.343×1.747 | |
| ROUT+ | passive | SMD | oval | 0.343×1.747 | |
| EP | passive | SMD | roundrect | 4.64×2.005 |
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Details
- Category
- ic
- MPN
- TPA6013A4PWP
- Manufacturer
- Texas Instruments
- Package
- HTSSOP-24
- Footprint
- HTSSOP-24_L7.8-W4.4-P0.65-LS6.4-BL-EP-1
- JLCPCB
- C4990878
- LCSC
- C4990878
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$7.4843
10-29 pcs$7.4843
30-199 pcs$7.4843
200-499 pcs$2.8964
500-999 pcs$2.7952
1000+ pcs$2.7454