ic
TPA6203DQ3/TR
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SHUTDOWN | input | SMD | roundrect | 0.35×0.625 | |
| BYPASS | output | SMD | roundrect | 0.35×0.625 | |
| IN+ | io | SMD | roundrect | 0.35×0.625 | |
| IN- | passive | SMD | roundrect | 0.35×0.625 | |
| VO1 | passive | SMD | roundrect | 0.35×0.625 | |
| VDD | power | SMD | roundrect | 0.35×0.625 | |
| GND | ground | SMD | roundrect | 0.35×0.625 | |
| VO2 | passive | SMD | roundrect | 0.35×0.625 | |
| EP | passive | SMD | roundrect | 2.45×1.65 |
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Details
- Category
- ic
- MPN
- TPA6203DQ3/TR
- Manufacturer
- HGSEMI
- Package
- DFN-8(3x3)
- Footprint
- DFN-8_L3.0-W3.0-P0.65-BL-EP2.45
- JLCPCB
- C52121516
- LCSC
- C52121516
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- -
JLCPCB Stock & Pricing
In Stock(5,000 pcs)
1-49 pcs$0.3085
50-149 pcs$0.2437
150-499 pcs$0.2160
500-2499 pcs$0.1813
2500-4999 pcs$0.1659
5000+ pcs$0.1567