ic
TPA8101-TS1R
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VDD1 | input | SMD | oval | 0.353×1.454 | |
| VINP | input | SMD | oval | 0.353×1.454 | |
| VINN | input | SMD | oval | 0.353×1.454 | |
| GND1 | passive | SMD | oval | 0.353×1.454 | |
| GND2 | passive | SMD | oval | 0.353×1.454 | |
| DOUT | output | SMD | oval | 0.353×1.454 | |
| CLKIN | passive | SMD | oval | 0.353×1.454 | |
| VDD2 | passive | SMD | oval | 0.353×1.454 |
Save parts to a list and design PCBs from them
Details
- Category
- ic
- MPN
- TPA8101-TS1R
- Manufacturer
- 3PEAK
- Package
- TSSOP-8
- Footprint
- TSSOP-8_L4.4-W3.0-P0.65-LS6.4-BL
- JLCPCB
- C44545374
- LCSC
- C44545374
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- -
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.7253
10-29 pcs$1.4378
30-99 pcs$1.2579
100-499 pcs$1.0747
500-999 pcs$0.9912
1000+ pcs$0.9543