ic
WIFI通信模块/WG223
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SD_CMD | input | SMD | roundrect | 2.3×1.1 | |
| SD_D3 | output | SMD | roundrect | 2.3×1.1 | |
| SD_D2 | io | SMD | roundrect | 2.3×1.1 | |
| SD_D1 | passive | SMD | roundrect | 2.3×1.1 | |
| SD_D0 | passive | SMD | roundrect | 2.3×1.1 | |
| SD_CLK | passive | SMD | roundrect | 2.3×1.1 | |
| GND | ground | SMD | roundrect | 2.3×1.1 | |
| GND | ground | SMD | roundrect | 2.3×1.1 | |
| RF | passive | SMD | roundrect | 2.3×1.1 | |
| WAKE | passive | SMD | roundrect | 2.3×1.1 | |
| VDIO | passive | SMD | roundrect | 2.3×1.1 | |
| VDD33 | passive | SMD | roundrect | 2.3×1.1 | |
| CS | input | SMD | roundrect | 2.3×1.1 |
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Details
- Category
- ic
- MPN
- WIFI通信模块/WG223
- Manufacturer
- JLCPCB Assembly
- Package
- LCC-13
- Footprint
- WIFI-SMD_13P_L14.0-W12.5
- JLCPCB
- C9900008982
- LCSC
- C9900008982
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-999 pcs$0.0007
1000+ pcs$0.0003